Job Details

Micron Technology is seeking a Senior Equipment Technical Leader in Boise, Idaho to support advanced packaging development. This role involves leading equipment programs for next-generation bonding, thinning, inspection, and assembly. Candidates must have a Master's degree or PhD in Mechanical, Electrical, or related fields, along with 10+ years of semiconductor experience. Micron offers competitive benefits focused on well-being and professional growth, including medical plans, paid time off, and more.#J-18808-Ljbffr