Job Details

Responsibilities

• Define and explore advanced package architectures for future memory systems
• Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
• Create hands‑on package designs and models for early feasibility analysis
• Run SI/PI and thermal simulations and translate results into architecture guidance
• Define package requirements and act as extension architecture and engineering

Minimum Qualifications

• Bachelor's degree or equivalent practical experience in EE, ME, Materials, or related field
• 10+ years of hands‑on experience in package design or package‑level simulation
• Strong experience with package SI modeling and analysis
• Ability to independently build models and drive conclusions

Preferred Qualifications

• Master's degree in a related technical field
• Experience supporting architecture or pre‑silicon exploration teams
• Familiarity with system‑level co‑design across silicon, package, and board
• Experience with multi‑die or heterogeneous integration

The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $177,000.00 - $387,000.00 a year. Additional compensation may include benefits, bonuses and equity.

Micron offers medical, dental, vision, income protection, paid family leave, paid time‑off, and paid holidays. For more information, please consult the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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